GlobalFoundries to Build TSMC CoWoS Interposers in US Under $2B Pact
A five-year manufacturing deal will see GlobalFoundries produce silicon interposers for TSMC’s advanced packaging, enabling US-branded AI chip production.
Key points
- GlobalFoundries and TSMC signed a $2 billion five-year agreement for interposer production.
- Manufacturing will occur at GlobalFoundries' facility in Malta, New York.
- Volume production is scheduled to begin in the first half of 2028.
GlobalFoundries and TSMC have finalized a five-year manufacturing agreement worth $2 billion, according to Tom's Hardware. Under this contract, GlobalFoundries will produce silicon interposers specifically for TSMC’s CoWoS advanced packaging technology. This partnership establishes a dedicated U.S.-based source for these critical components within the semiconductor supply chain.
The deal allows TSMC customers to label their final products as fully made and packaged in America, according to Tom's Hardware. This branding capability is a key strategic benefit of the arrangement. Volume production is set to ramp up during the first half of 2028. The agreement provides a framework for additional capacity expansion if market demand increases, though specific production numbers remain undisclosed.
Manufacturing and Technical Details
GlobalFoundries will expand its fabrication capacity in Malta, New York, to support this initiative, according to Tom's Hardware. The facility will produce silicon interposers that are integral to TSMC’s CoWoS-S packaging ecosystem. These interposers are custom silicon pieces that create high-density connections between logic chiplets and high-bandwidth memory stacks. They enable the construction of complex multi-die processors used in artificial intelligence and high-performance computing applications.
Ed Kaste, GlobalFoundries’ senior vice president of CMOS Business, stated that the company is leveraging its trusted U.S. manufacturing footprint to provide these services, according to Tom's Hardware. He noted that this approach creates a secure and scalable source for essential advanced-packaging elements. Kaste added that this supply chain strengthening will help customers accelerate innovation.
Silicon interposers for CoWoS-S are highly customized for specific processor designs, according to Tom's Hardware. Their configurations depend on the number, dimensions, and placement of logic chiplets and high-bandwidth memory stacks. The design must also account for the interconnections between these components.
Design Complexity and Challenges
Interposers must meet strict power-delivery requirements for specific processors, according to Tom's Hardware. This includes integrating power distribution networks and embedded deep trench capacitors. Designs must also ensure signal integrity, power integrity, and appropriate thermal characteristics. These technical constraints make each interposer application-specific, despite some standardized manufacturing processes.
Large interposers often exceed the maximum lithographic reticle size, requiring a stitching process to assemble them, according to Tom's Hardware. It remains to be seen how effectively GlobalFoundries will stitch these extra-large system-in-packages. This technical challenge is a notable factor in the production of advanced CoWoS-S components.
What should you do?
Monitor supply chain disclosures for changes in manufacturing locations, as geopolitical factors may influence sourcing. Review vendor documentation for details on where specific chip components are fabricated. Assess your organization’s reliance on advanced AI accelerators for potential supply chain dependencies. Track updates on production timelines to plan procurement strategies accordingly.
What to do and how to stay safe: GlobalFoundries
- Review vendor documentation to identify where specific chip components are fabricated.
- Assess your organization’s reliance on advanced AI accelerators for supply chain dependencies.
- Monitor supply chain disclosures for changes in manufacturing locations or partners.
- Track updates on production timelines to plan procurement strategies accordingly.
Step-by-step guide: Prompt Injection Warning Signs: How to Spot AI Manipulation
General security guidance from the Threat Times newsroom. It is not confirmed advice from the organisations named in this story.
Frequently asked questions
What is the total value of the agreement between GlobalFoundries and TSMC?
The agreement is valued at $2 billion and spans five years, according to Tom's Hardware.
When will volume production of the interposers begin?
Volume production is scheduled to ramp up in the first half of 2028, according to Tom's Hardware.
Where will GlobalFoundries manufacture these silicon interposers?
Manufacturing will take place at GlobalFoundries' facility in Malta, New York, according to Tom's Hardware.
