Tech News
Microsoft's Maia 300 chips offer 40% more tokens per megawatt, set to power AI by 2027
The tech giant unveiled its third-generation custom silicon, aiming to power its AI services with gigawatt-scale deployments by 2027.
TSMC
Everything Threat Times has reported about TSMC: 8 stories, newest first. Part of our Tech News coverage.
Tech News
Microsoft Announces Maia 300 AI Chip for 2027 Production Rollout
Microsoft unveils its third-generation custom AI accelerator, targeting greater efficiency and reduced reliance on external GPU vendors for cloud inference.
Tech News
Applied Materials opens $5B Silicon Valley facility for chip R&D
The new EPIC Center aims to cut semiconductor development cycles by 30% through collaborative work with major industry partners.
Tech News
Microsoft unveils Maia 300 AI accelerator to challenge NVIDIA at gigawatt scale
The new chip uses a dataflow architecture to process 40% more tokens per megawatt than leading GPU-based systems.
AI
Microsoft to deploy Maia 300 AI chip for inference in 2027
The third-generation processor, built on TSMC’s N2P node, will serve as Microsoft’s primary system for artificial intelligence inference tasks.
Tech News
TSMC Executives Begin Serious Texas Talks in H1 2026 After Decade of On-and-Off Discussions
TSMC officials in charge of overseas operations have started more serious discussions with Texas authorities in the first half of 2026, following over ten years of intermittent talks.
AI
GlobalFoundries to Build TSMC CoWoS Interposers in US Under $2B Pact
A five-year manufacturing deal will see GlobalFoundries produce silicon interposers for TSMC’s advanced packaging, enabling US-branded AI chip production.
Tech News
GlobalFoundries Signs $2B Five-Year Silicon Interposer Deal With TSMC
GlobalFoundries agreed to a $2 billion, five-year agreement to supply silicon interposer capacity to TSMC from its Malta, New York facility.