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GlobalFoundries to launch 7nm-class FDX Fusion process in Dresden by 2028
The chipmaker returns to advanced FD-SOI development with a planar transistor node targeting automotive and edge AI applications.
Everything Threat Times has reported about GlobalFoundries: 3 stories, newest first. Part of our Tech News coverage.

The chipmaker returns to advanced FD-SOI development with a planar transistor node targeting automotive and edge AI applications.

A five-year manufacturing deal will see GlobalFoundries produce silicon interposers for TSMC’s advanced packaging, enabling US-branded AI chip production.

GlobalFoundries agreed to a $2 billion, five-year agreement to supply silicon interposer capacity to TSMC from its Malta, New York facility.