AI
GlobalFoundries to Build TSMC CoWoS Interposers in US Under $2B Pact
A five-year manufacturing deal will see GlobalFoundries produce silicon interposers for TSMC’s advanced packaging, enabling US-branded AI chip production.
AI accelerators
Everything Threat Times has reported about AI accelerators: 2 stories, newest first. Part of our AI coverage.
AI
Oracle reportedly signs $7B GPU deal with Tencent for Southeast Asian AI compute
The unconfirmed five-year agreement would provide Tencent with access to roughly 100,000 advanced accelerators, helping it bypass U.S. equipment export restrictions.