Samsung Agrees to Make Nvidia NVHBM Base Dies on TSMC 3nm Process

Samsung Electronics has agreed to manufacture base dies for Nvidia’s custom NVHBM memory using TSMC’s 3-nanometer process. According to Reuters, this agreement marks the first time Samsung has utilized TSMC’s 3nm technology for this specific application, signaling a significant shift in semiconductor supply chain dynamics.

Nvidia approached three major memory manufacturers, including Samsung, SK Hynix, and Micron, with this specific request. The company asked these vendors to produce the base dies for its custom NVHBM memory on TSMC’s 3nm process. Samsung was the vendor that agreed to this arrangement, as reported by Kyu-Seok Shim of Reuters.

Supply Chain Implications

This development represents a notable change in how high-performance memory components are sourced and manufactured. Samsung Electronics, typically a leader in both memory and process technology, is now relying on TSMC’s 3nm process for a critical component of Nvidia’s custom memory. This is the first instance of Samsung using TSMC’s 3nm process for this purpose, according to the report.

The involvement of TSMC, a major semiconductor foundry, in the production of base dies for Nvidia’s NVHBM highlights the increasing complexity of advanced chip manufacturing. Nvidia’s decision to request this specific manufacturing setup from multiple vendors suggests a strategic move to optimize performance or capacity for its custom memory solutions.

Industry Partnerships

The request extended to SK Hynix and Micron, in addition to Samsung. While Samsung agreed to the terms, the outcomes for SK Hynix and Micron were not specified in the report. This indicates that Nvidia is exploring multiple avenues for securing the production of its custom NVHBM base dies using TSMC’s advanced process technology.

Samsung’s agreement to use TSMC’s 3nm process underscores the evolving partnerships within the semiconductor industry. As chip designs become more complex, companies are increasingly collaborating across traditional boundaries to meet performance and production requirements. This move by Samsung to utilize TSMC’s process for Nvidia’s memory components is a clear example of this trend.

What should you do?

Security and technology professionals should monitor developments in semiconductor supply chains for potential impacts on hardware availability and performance. Understanding the relationships between chip designers, memory manufacturers, and foundries can provide insights into future product launches and technological advancements.

What to do and how to stay safe: Nvidia

• Monitor industry reports for updates on semiconductor manufacturing partnerships and their impact on hardware availability.
• Assess how changes in supply chain dynamics might affect the performance or cost of high-performance computing components.
• Review vendor disclosures for information on manufacturing processes used in critical hardware components.
• Stay informed about advancements in semiconductor technology that could influence future product development.

Step-by-step guide: Mobile Device Security: How to Protect Data Beyond Passwords

General security guidance from the Threat Times newsroom. It is not confirmed advice from the organisations named in this story.

Frequently asked questions

Which companies were asked by Nvidia to manufacture base dies for its custom NVHBM memory?

Nvidia asked Samsung, SK Hynix, and Micron to make base dies for its custom NVHBM memory on TSMC's 3nm process.

Did Samsung agree to Nvidia's request?

Yes, Samsung agreed to use TSMC's 3-nanometer process to produce base dies for Nvidia's custom NVHBM memory.

Is this the first time Samsung has used TSMC's 3nm process?

Yes, according to the report, this is Samsung's first use of TSMC's 3nm process for this specific application.